Quality is not a phase.
It is built into every step.
Our quality process was adopted back in 2004. Today we track every board from incoming material control to outgoing control of the finished device.
Quality process
Incoming control
Inspection of materials and components.
SPI
Solder-paste deposition control.
SMT + Reflow
Assembly and controlled profile.
3D AOI
Optical inspection of every board.
Functional / Burn-In
Testing and temperature ageing.
Outgoing control
Final check before delivery.
What and how we measure
That many boards have passed through 3D AOI
The first 3D AOI inspection (Parmi Xceed) was installed in 2020. Every assembled board is optically inspected before it leaves.
Parmi Xceed — optical inspection of every board
The first 3D AOI in the facility was installed in 2020. It measures solder height, position and volume — no subjective operator judgment.
Three ISO certificates
Quality management
Foundation of the process since 2004 — consistency and traceability.
Environmental management
Lead-free and RoHS production with care for the environment.
Medical devices
Standard for electronics for medical use.
Class 2 / 3
We have applied the acceptability standard for electronic assemblies in classic and AOI inspection since 2009.
Send us your documentation — we'll get back with a quote.
Prototype or volume, turn-key or assembly only. Tell us what you need and we start.
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