Two fully separate SMT and THT lines, 3D AOI inspection of every board and an ISO-certified process. From prototype to volume, turn-key — for automotive, medical, telecom and industry.
SMT and THT assembly in ROHS and Non-ROHS technology, with value-added services — from material procurement to testing, integration and delivery.
Samsung pick&place equipment places components down to 0201, QFP, QFN, DFN, BGA and fine-pitch CSP. Volumes from samples up to 50,000 pcs per type per year.
Learn more
Separate lines for wave soldering of classic components, ROHS and Non-ROHS. Up to 30,000 pcs per type per year for automotive and industry.
Learn more
Turn-key: PCB and material procurement, SMD and THT assembly, testing, enclosure integration and delivery as agreed. Prototypes too.
Learn more
Temperature ageing in a chamber, Burn-In testing −40 °C / +80 °C, programming, functional testing and packaging.
Learn moreComponents are placed at high speed, and every populated board passes 3D optical inspection before it leaves the line. No manual guessing — everything is measured and logged.
Samsung-Hanwha SM482+ i CP-45FV Neo — flexible lines up to 30,000 comp/h.
Heller 1707 MKIII 7 zones, ERSA lead-free wave — ROHS and Non-ROHS.
Parmi Xceed — nearly 15,000 inspected boards. IPC-A-610 Class 2 / 3.
Our quality process was adopted back in 2004. Today we track every board from paste to delivery.
9001:2015, 14001:2015 and 13485:2016 — including the medical standard.
Parmi Xceed automated optical inspection of every board, first 3D AOI installed in 2020.
Acceptability standard for electronic assemblies, applied in classic and AOI inspection.
Temperature ageing in a chamber −40 °C / +80 °C and functional testing of devices.
A clear, repeatable flow — every step documented and measured.
Documentation review and manufacturability feedback.
Boards and components — turn-key or to your BOM.
EKRA X4SI inline printer applies solder paste.
Pick&place places components down to BGA and 0201.
Heller 7-zone reflow, ROHS or Non-ROHS profile.
Through-hole assembly and lead-free wave soldering.
Optical inspection, burn-in and functional testing.
Enclosure integration, packaging and delivery as agreed.
Cooperations in automotive, telecom, military and industrial sectors — from Croatia to Switzerland.
Cooperation on special and military devices and systems.
Industrial assemblies, sensors and pressure transducers.
Electronic devices and components for special purposes.
Long-standing Swiss partner and export of services.
Advanced electronic, IT and communication solutions.
Microprocessor devices, voice automats, switch clocks.
Prototype or volume, turn-key or assembly only. Tell us what you need and we start.
Send inquiry for a quote
