SMD assembly down to the last component.
An SMT line with Samsung pick&place equipment places components down to 0201, BGA and fine-pitch CSP — flexibly, from samples to series.
What we do
Samsung-Hanwha SM482+ and CP-45FV Neo place components at high speed, with inline SPI control of solder-paste deposition before placement.
The line is flexible — fast change of versions, quantities and programs means we run samples and series up to 50,000 pcs per type per year equally efficiently.
Send inquiryTechnical capabilities
Process
Stencil & paste
EKRA X4SI applies solder paste.
SPI
Paste height and volume control.
Pick & place
Placement down to 0201 and BGA.
Reflow
Heller 7-zone profile.
3D AOI
Optical inspection of every board.
Outgoing control
Final check.
We place 0201, fine-pitch QFN and BGA with 3D AOI verification of every joint.
Send us your documentation — we'll get back with a quote.
Prototype or volume, turn-key or assembly only. Tell us what you need and we start.
Send inquiry for a quote